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| Mingkun Technologies Co., Ltd. Manufacturers |
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| Back Grinding Tape |
| The back grinding tape can protect the wafer surface circuits and prevent damage while wafer back side grinding process. |
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| Thermal Release Tape |
| It can fix the product & substrate while high temperature process. The tape can be peeled off by rising up temp. |
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| PI Tape (Polyimide tape) |
| Polyimide film-based tape, widely used in high temperature processes,with high heat resistance and dimensional stability |
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| UV dicing tape |
| While the tape is applied to the dicing process, it can fix the chip to prevent the occurrence of flying chip. |
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