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Thermal Release Tape

It can fix the product & substrate while high temperature process. The tape can be peeled off by rising up temp.

Thermal Release Tape Product Photo
Product No.
Product Prices E-mail
Minimum Order E-mail
Delivery Days 14 day
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Structure

熱解膠帶Thermal Release Tape

 

Application

Thermal Release Tape

 

Product 

Base Film (um)

 25~75

Adhesive Thickness (um)

 30~50

Adhesion to Steel(gf/in)

 100~400

Temp. Range(°C)

 120~175

Application for Process:WLCSP、Fan-Out、Molding、Sputter、Spray Coating、Plating

  

 

 

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