繁體站
 
 
Home > Products › Electronic Components (電子零組件) › › consumer electronic products › Mingkun Technologies Co., Ltd. › All Products
Mingkun Technologies Co., Ltd.　Manufacturers
Contact Info About Us All Products Trade Leads Contact Us
business items
 

Back Grinding Tape

The back grinding tape can protect the wafer surface circuits and prevent damage while wafer back side grinding process.
Back Grinding Tape Product Photo
Product No.
Product Prices E-mail
Minimum Order E-mail
Delivery Days 15 day
INQUIRY

Structure

 

 

Application

・Wafer Grinding 

・Bump Wafer

 

Product

Base Film (um)

 50 ~ 500

Adhesive Thickness (um)

 20 ~ 40

Adhesive Strength Before UV(gf/inch)

 400 ~ 1,000

Adhesive Strength After UV

 Very Low

Temp. Range(°C)

 Max 100

Application：Wafer 、Glass

Go Back
 
Member Services 　Forget Password
more  
more  
 
Login | Join | Member Services | Contact us
BysourcesNo.287, Sec. 1, Xiangshang S. Rd., Nantun Dist., Taichung City 408, Taiwan (R.O.C.)
By BySources copyright(c) 2001-2024 . all right reserved.